A transparent solution of methyl-phenyl-silicone resin in xylene used as a binder of temperature and weather resistant coatings or an adhesive component of electro-insulating layers. The resin dries at normal temperature (5 hours). It must then be cured at a minimum of 200 °C to form a mechanically and thermal resistant film.
Packaging: 17 kg tin
|Appearance||clear, yellowish liquid immiscible with water|
|Viscosity||80 - 150 mPa.s|
|The active substance content||50 % methylphenylsilicone resin|
|Dielectric strength||min. 60 kV/mm|
|Thermal resistance||250 - 300°C|