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A transparent solution of methyl-phenyl-silicone resin in xylene used as a binder of temperature and weather resistant coatings or an adhesive component of electro-insulating layers. The resin dries at normal temperature (5 hours). It must then be cured at a minimum of 200 °C to form a mechanically and thermal resistant film.
Packaging: 17 kg tin
Availability date:
| Appearance | clear, yellowish liquid immiscible with water | 
| Viscosity | 80 - 150 mPa.s | 
| The active substance content | 50 % methylphenylsilicone resin | 
| Dielectric strength | min. 60 kV/mm | 
| Thermal resistance | 250 - 300°C |